Luowei LW-SP3 is a professional solder paste developed for microsoldering and high-precision electronic repairs.
Its lead-free and halogen-free formula provides clean, stable, and safe solder joints, making it ideal for smartphones, motherboards, PCB circuits, and other
sensitive electronic components. The fine and uniform texture ensures excellent adhesion and precise distribution of the solder alloy, contributing
to the formation of strong, bubble-free connections. Advanced wetting properties facilitate the soldering process and reduce the risk of surface oxidation,
extending the lifespan of the connections made. The high-viscosity formula offers excellent control in precision applications
and maintains its properties over time due to increased oxidation resistance and storage stability. Additionally, the non-conductive composition
helps protect circuits during soldering operations. Available in multiple melting point variants, Luowei LW-SP3 can
be used for various types of repairs and electronic assembly processes.
Features:
- Quantity: 30 g
- Lead-free and halogen-free formula
- Fine and uniform texture for precise application
- High viscosity for excellent control
- Excellent wetting properties
- Reduces oxidation of soldering surfaces
- Does not produce bubbles during soldering
- Non-conductive properties for circuit safety
- High storage stability
- Increased oxidation resistance
- Melting temperatures: 138 degrees C
- Suitable for smartphones, motherboards, PCBs, and other precision electronic components
- Recommended for microsoldering and professional electronic repairs